Sarcon pg45a is the lowest modulus thermal interface putty available.
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Very high thermal.
This line of thermal pads are much more effective than stock pads.
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It is ideally suited for applications requiring low compression force on the component.
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The putty like material exhibits a high thermal conductivity and low thermal resistance while conforming to even the smallest protrusions and depressions on components to make complete.
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These are custom cut to a smaller more applicable size.
The extreme thermal pad is a ready to use high end thermal pad.
With a 11 0 watt mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well.
We operate a global network of 9 manufacturing and distribution centers to deliver you unprecedented product performance and dependability.
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Fujipoly is the leader in the design formulation and production of high performance thermal interface materials elastomeric connectors and custom silicone extrusions.